Expert Design: Starting with a highly qualified chief engineer with senior professional credentials instills confidence in the initial design phase. This is crucial for preventing problems before they even reach manufacturing.
Automated Manufacturing: Using a first-class automated patch production line minimizes human error in the assembly process. This contributes to consistency and precision.
AOI Inspection at Multiple Stages: The use of AOI (Automated Optical Inspection) after patching and wave soldering is excellent. It allows for early detection of a wide range of defects, preventing them from propagating further down the line. Identifying issues like offsets, short circuits, and insufficient solder early is key to maintaining a high yield.
Functional Testing: Testing each circuit board on a test bench is essential to verify that the design is implemented correctly and that all components are functioning as expected.
Aging Process (Burn-in): The long-term power-on and power-off aging (burn-in) of the circuit boards is a critical step. This process helps identify potential early failures in components, weeding out weak parts before they are integrated into the final product. This significantly improves product reliability.
Moisture and Corrosion Protection: The dehumidification, coating, and thermosetting process for the aged motherboards adds an extra layer of protection against environmental factors. This is particularly important for products that will be used in harsh or humid conditions.
Final Assembly and Testing: Testing the complete assembled machine and then subjecting it to further power aging provides a final check to ensure that everything works together correctly and that the final product meets quality standards.
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